Pulse-reverse rectifier for advanced plating process
Engineered for Performance and Quality
The ModuPulse Series is KraftPowercon’s periodic pulse rectifier, built for precision-critical electroplating applications.
Developed together with leading PCB and semiconductor manufacturers, it addresses key customer challenges — achieving perfect layer uniformity, complex surface shape, and consistent quality over time.
The digital control platform manages up to 40 programmable current steps, complex waveform, current amplitude adjustable from –1000 % to +1000 %, helping customer acheiving high productivity and quality with low chemical cost.
High precision
Quick pulse control ensures high current accuracy, uniform layer thickness, and consistent process quality.
Consistent production quality
Modular reliability ensures stable performance and repeatability over long production runs.
Lower chemical and scrap cost
Controlled pulse amplitude and reverse-pulse capability reduce additive consumption and minimize rejects.
Pulse-reverse rectifier for advanced plating process
- ModuPulse
- ModuPulse X
- ModuPulse XC
Quality and Cost Stability
Even the smallest deviation in current distribution can create uneven copper thickness or costly scrap.
Chemical balance and bath agitation help, but cannot replace precise power control.
Without accurate waveform and repeatable output, achieving uniform plating across the entire panel remains a challenge.
ModuPulse eliminates that variable by delivering digitally shaped pulses with clean, stable current — securing quality, uptime, and cost efficiency.
Intelligent Pulse Current
ModuPulse rectifiers synchronize current and voltage with high accuracy to maintain plating uniformity and reduce additive use.
The modular design allows scalable output, straightforward maintenance, and continuous operation even under heavy load.
Each unit supports DC, pulse, and reverse-pulse operation, enabling complex waveform control and reproducible process optimization.
ModuPulse PCB plating rectifier
- Features
- Technical Data
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High-demand applications
- High aspect ratio PCB plating and filling
- IC substrate plating
- Precious metal plating
- Electroforming
- Electroetching
- Other microstructure surface finishing
ModuPulse
- Quick assistance
- Product Support
